Ref: SF47385

R&D Engineer

職種 IT/通信/エンジニアリング
雇用形態 Full-time, Permanent
勤務地 日本国内 その他
給与(年収) Negotiable / Neg
A global technology company is currently recruiting an R&D Engineer to join their team in Aichi, Japan. In this role, you will be responsible for developing and evaluating light emitting devices, while supporting packaging, testing, and product optimisation activities in collaboration with cross-functional teams.
The ideal candidate should have experience with LEDs, laser diodes, or other optical emitters, along with knowledge of semiconductor device technology, packaging processes, and thermal management.
Ref: SF47385

TYPE: Permanent, full-time
WORK TYPE: Office-based
WORKING HOURS: 8:15-17:30 from Monday to Friday (40h/week)
SALARY: Negotiable, depending on experience
START: ASAP
VISA SUPPORT: Yes
LOCATION: Aichi, Japan

R&D Engineer Main Responsibilities:
• Contribute to the research and development of light emitting devices, including design, prototyping, testing, and performance evaluation
• Perform hands-on experimental work to develop and optimise light source structures, including material selection, device architecture, and thermal design
• Conduct optical, electrical, and thermal measurements to characterize device performance and identify improvement opportunities
• Analyse test data, prepare technical reports, and present findings to the R&D team
• Collaborate with process engineers, packaging engineers, and manufacturing teams to support the transition from prototype to production
• Assist in reliability testing, failure analysis, and long-term performance evaluation
• Participate in design reviews and technical discussions within the R&D group
• Maintain laboratory equipment and contribute to continuous improvement of workflows

R&D Engineer Ideal Candidate:
• Bachelor’s degree in Electrical Engineering, Electronic Engineering, Optoelectronics, Photonics, Materials Science, Applied Physics, or a related field
• Experience in the development of LEDs, laser diodes, or other light-emitting devices
• Understanding of semiconductor device physics, including light generation and bandgap engineering
• Experience with optoelectronic packaging processes such as die bonding, wire bonding, flip-chip assembly, and ceramic substrate integration
• Knowledge of thermal management and high-power device design
• Ability to evaluate optical, electrical, and thermal device performance
• Business-level English

Visa support may be considered depending on experience.
更新日: 1 hour ago
Ref: SF47385